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The LinkSwitch™-HP family of flyback power supply ...
The LinkSwitch™-HP family of flyback power supply ICs integrates a primary-side regulation (PSR) controller and a high-voltage power MOSFET in a single package. The devices offered in this IC family provide extremely tight constant voltage (CV) regulation in the power range of 9 W to 90 W.
characteristic
EcoSmart™ – Energy Efficient
• Multi-mode control improves efficiency across the entire load range
• No-load power consumption is less than 30 mW at 230 VAC input
• Efficiency >75% at 230 VAC input and 1 W input power
• Efficiency >50% at 230 VAC input and 0.1 W input powerIncrease
design flexibility and reduce system cost
• Greatly simplifies power supply design
• 132 kHz operation reduces transformer and power supply size
• Accurate current limit programming is possible
• Frequency modulation technology reduces the cost of EMI filtering components
• Fully integrated soft-start circuitry reduces device startup stress
• 725 V MOSFET simplifies design and easily meets derating requirements (LNK677x)
• 650 V MOSFET for lowest system cost (LNK676x/LNK666x)
• Optional fast transient response product family (LNK666x)
Comprehensive protection features
• Output short-circuit protection (SCP)
• Output overload/overcurrent protection (OPP, OCP)
• Selectable extended turn-off delay
• Output overvoltage protection (OVP), hysteresis or latching
• Voltage ramp-up/down protection (input undervoltage)
• Input overvoltage (OV) shutdown enhances input surge immunity
• Accurate thermal shutdown (OTP), hysteresis or latching
Advanced Green Package Options
• eSIP™-7C package:
- Vertical package feature reduces PCB footprint
- Use clip or adhesive pad to simplify heat sink installation
• eSOP®-12B package:
- Ultra-thin surface mount for ultra-thin product designs
- Heat is transferred to the PCB through exposed pad and source pins
- Supports wave soldering and reflow soldering
• eDIP™-12B package:
- Low-profile through-hole mounting for ultra-thin designs
- Heat is transferred to the PCB through exposed pad or optional metal heat sink
• Increased creepage distance to drain pin
• Heat sink connected to source for reduced EMI
• Halogen-free and RoHS compliant
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