The 6N138 and 6N139 devices each consists of an infrared emitting diode, optically coupled to a high gain split Darlington photo detector. They provide extremely high current transfer ratio between input and output, with access to a base terminal to adjust the gain bandwidth. These devices are packaged in an 8-pin DIP package and available in wide-lead spacing and SMD options.

The Toshiba TLP2395 consists of two GaA ℓAs light-emitting diode coupled with a high-gain, high-speed photo detector. It is housed in the SO6 package. Since it is making two LED reverse parallel, it can be dealt with both sinking and sourcing input signals. The detector has a totem-pole output stage with current sourcing and sinking capabilities. The TLP2395 has an internal Faraday shield that provides a guaranteed common-mode transient immunity of ±20 kV/µs. The TLP2395 has a logic buffer output. An inverter output version, the TLP2398, is also available. Application Programmable Logic Controllers (PLCs) High-Speed Digital Interfacing for Instrumentation and Control Devices Simplex/Multiplex Data Transmission Features (1) Buffer logic type (totem pole output) (2) Package: SO6 (3) Supply voltage: 3 to 20 V (4) Threshold input voltage, low to high: IFLH = ±2.3 mA (max) (5) Propagation delay time: tpHL/tpLH = 250 ns (max) (6) Pulse width distortion: |tpHL - tpLH| = 80 ns (max) (7) Common-mode transient immunity: ±20 kV/ µs (min) (8) Operating temperature: -40 to 125  (9) Isolation voltage: 3750 Vrms (min) (10) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Note 1) CQC-approved: GB4943.1, GB8898 Thailand Factory

Processors - Application Specialised i.MX6UL The i.MX 6UltraLite is a high performance, ultraefficient processor family featuring NXP’s advanced implementation of the single ARM Cortex®-A7 core, which operates at speeds up to 528 MHz. The i.MX 6UltraLite includes an integrated power management module that reduces the complexity of the external power supply and simplifies the power sequencing. Each processor in this family provides various memory interfaces, including LPDDR2, DDR3, DDR3L, Raw and Managed NAND flash, NOR flash, eMMC, Quad SPI, and a wide range of other interfaces for connecting peripherals, such as WLAN, Bluetooth™, GPS, displays, and camera sensors.