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08042755673
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08042755673
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Integrated Circuits by POWER INTEGRATION

LNK6666E

INR 30

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Description

The LinkSwitch™-HP family of flyback power supply ICs integrates a primary-side regulation (PSR) controller and a high-voltage power MOSFET in a single package. The devices offered in this IC family provide extremely tight constant voltage (CV) regulation in the power range of 9 W to 90 W. characteristic EcoSmart™ – Energy Efficient • Multi-mode control improves efficiency across the entire load range • No-load power consumption is less than 30 mW at 230 VAC input • Efficiency >75% at 230 VAC input and 1 W input power • Efficiency >50% at 230 VAC input and 0.1 W input powerIncrease design flexibility and reduce system cost • Greatly simplifies power supply design • 132 kHz operation reduces transformer and power supply size • Accurate current limit programming is possible • Frequency modulation technology reduces the cost of EMI filtering components • Fully integrated soft-start circuitry reduces device startup stress • 725 V MOSFET simplifies design and easily meets derating requirements (LNK677x) • 650 V MOSFET for lowest system cost (LNK676x/LNK666x) • Optional fast transient response product family (LNK666x) Comprehensive protection features • Output short-circuit protection (SCP) • Output overload/overcurrent protection (OPP, OCP) • Selectable extended turn-off delay • Output overvoltage protection (OVP), hysteresis or latching • Voltage ramp-up/down protection (input undervoltage) • Input overvoltage (OV) shutdown enhances input surge immunity • Accurate thermal shutdown (OTP), hysteresis or latching Advanced Green Package Options • eSIP™-7C package: - Vertical package feature reduces PCB footprint - Use clip or adhesive pad to simplify heat sink installation • eSOP®-12B package: - Ultra-thin surface mount for ultra-thin product designs - Heat is transferred to the PCB through exposed pad and source pins - Supports wave soldering and reflow soldering • eDIP™-12B package: - Low-profile through-hole mounting for ultra-thin designs - Heat is transferred to the PCB through exposed pad or optional metal heat sink • Increased creepage distance to drain pin • Heat sink connected to source for reduced EMI • Halogen-free and RoHS compliant

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