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Advanced Process Technology Surface Mount (IR-244N6) Low-profilethrough-hole (RF 244NL) 175 C Operating Temperature Fast Switching Fully Avalanche Rated Lead-Free Description Advanced HEXFETY Power MOSFETs from international Rectifer utilize advanced processing techniques to achieve extreme y low on resistance per silicon area. This benefit. Combined with the fast switching speed and ruggedized device design that HEXF ET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The D-Pakis a surface mount power package capable of accommodating die sizes up to HEX 4. Itprovides thehighest power capability and the lowest possible on resistance in any existing surfacemount package. The D-Pak is suitable for high current applications because of its low internali connection resistance and can dissipate up to 2.0W in a typical surface mount application The through hole version (IRFZ44NL) is available for low-profile applications.